Japan and US agree on $21bn semiconductor project in New York

Japan announced today that it has reached an agreement with the United States to launch a joint semiconductor manufacturing project in New York State, with investments totaling around $21 billion.

This marks the third investment initiative under the bilateral trade agreement signed by the two countries last year, which granted Japan exemptions from US tariffs.

The project aims to strengthen the resilience of global semiconductor supply chains by expanding the production of chips used in sectors such as automotive, industrial machinery, smartphones, and artificial intelligence data centers.

Relevant authorities emphasized the importance of the project in supporting technological capabilities and meeting the growing global demand for semiconductors.